发明名称 HEAT DISSIPATION IN POWER ELECTRONIC ASSEMBLIES
摘要 A three-phase two-level power electronics assembly is disclosed in one form including a thermally conductive base plate, a heat dissipation unit, mounted on a first face of the base plate, connectors for three-phase AC output, chopper DC outputs, and two poles of a DC link, and a set of power electronics devices mounted on a second face of the base plate, whereby the power electronic devices are arranged within the three-phase two-level power electronics assembly in rows to provide a three phase AC output as well as chopper DC outputs and connected to the respective connectors, whereby the rows connected to the three-phase AC output and the rows connected to the chopper DC outputs are alternately arranged on the base plate. Also disclosed is a power converter, in particular a static power converter, having at least one three-phase two-level power electronics assembly as specified above.
申请公布号 US2017079159(A1) 申请公布日期 2017.03.16
申请号 US201615265354 申请日期 2016.09.14
申请人 ABB Schweiz AG 发明人 Schluer Tobias
分类号 H05K7/20;H02M1/08;H02M7/00 主分类号 H05K7/20
代理机构 代理人
主权项 1. Three-phase two-level power electronics assembly comprising a thermally conductive base plate, a heat dissipation unit, mounted on a first face of the base plate, connectors for three-phase AC output, chopper DC outputs, and two poles of a DC link, and a set of power electronics devices mounted on a second face of the base plate, whereby the power electronic devices are arranged within the three-phase two-level power electronics assembly in rows to provide a three phase AC output as well as chopper DC outputs and connected to the respective connectors, wherein the rows connected to the three-phase AC output and the rows connected to the chopper DC outputs are alternately arranged on the base plate.
地址 Baden CH