| 发明名称 |
METHODS AND APPARATUS FOR IMPROVED BONDING |
| 摘要 |
Various embodiments of the present technology may comprise a method and apparatus for improved bonding and may operate in conjunction with a main platform configured to support a substrate. Movable members may allow the substrate to be positioned on the main platform when rotated to a first position and apply a force to a predetermined area on an upward facing surface of the substrate when rotated to the second position. |
| 申请公布号 |
US2017077061(A1) |
申请公布日期 |
2017.03.16 |
| 申请号 |
US201615135973 |
申请日期 |
2016.04.22 |
| 申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
ONAI Nobuhisa;TAGUCHI Takayuki |
| 分类号 |
H01L23/00;B23K20/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for securing a substrate, comprising:
a main platform configured to support the substrate; a plurality of movable members positioned above the main platform and rotatable between a first position and a second position, wherein each movable member:
allows the substrate to be positioned on the main platform when rotated to the first position; andapplies a force to a predetermined area on an upward facing surface of the substrate when rotated to the second position. |
| 地址 |
Phoenix AZ US |
