| 发明名称 |
METHOD FOR HIGH THROUGHPUT USING BEAM SCAN SIZE AND BEAM POSITION IN BEAM PROCESSING SYSTEM |
| 摘要 |
A system and method for performing location specific processing of a workpiece is described. The method includes placing a microelectronic workpiece in a beam processing system, selecting a beam scan size for a beam scan pattern that is smaller than a dimension of the microelectronic workpiece, generating a processing beam, and processing a target region of the microelectronic workpiece by irradiating the processing beam along the beam scan pattern onto the target region within the beam scan size selected for processing the microelectronic workpiece. |
| 申请公布号 |
US2017077001(A1) |
申请公布日期 |
2017.03.16 |
| 申请号 |
US201615266639 |
申请日期 |
2016.09.15 |
| 申请人 |
TEL Epion Inc. |
发明人 |
Chae Soo Doo;Russell Noel;LaRose Joshua;Joy Nicholas;Fernandez Luis;Leith Allen J.;Caliendo Steven P.;Shao Yan;Lagana-Gizzo Vincent |
| 分类号 |
H01L21/66;G05B19/406;H01L21/263 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for performing location specific processing of a workpiece, the method comprising:
placing a microelectronic workpiece in a beam processing system; selecting a beam scan size for a beam scan pattern that is smaller than a dimension of the microelectronic workpiece; generating a processing beam; and processing a target region of the microelectronic workpiece by irradiating the processing beam along the beam scan pattern onto the target region within the beam scan size selected for processing the microelectronic workpiece. |
| 地址 |
Billerica MA US |
