| 发明名称 |
SOLID COOLING ARRANGEMENT FOR ELECTRONIC DEVICE |
| 摘要 |
The present disclosure provides a electronic device having quiet cooling, to improve heat dissipation efficiency and increase space utilization. The present disclosure comprising circuit boards, fixer(s), cooling elements installed around the outside surfaces of said circuit boards. The present disclosure further comprising joint cooling fan for hours of compute intensive tasks. |
| 申请公布号 |
US2017075395(A1) |
申请公布日期 |
2017.03.16 |
| 申请号 |
US201615199943 |
申请日期 |
2016.06.30 |
| 申请人 |
Qingyuan Li |
发明人 |
Qingyuan Li |
| 分类号 |
G06F1/20;G06F1/18;H05K7/20 |
主分类号 |
G06F1/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A electronic device having quiet cooling, comprising:
circuit boards, fixer(s), cooling elements installed around the outside surfaces of said circuit boards. |
| 地址 |
Beijing CN |
