发明名称 NEAR-INFRARED ABSORBING CURABLE COMPOSITION, CURED FILM, SOLID-STATE IMAGING ELEMENT, INFRARED ABSORBENT AND COMPOUND
摘要 Provided is a near-infrared absorbing curable composition which is capable of forming a cured film that has excellent infrared light shielding properties and visible light transparency, while exhibiting excellent heat resistance and light resistance. Also provided are a cured film, a solid-state imaging element, an infrared absorbent and a compound. This near-infrared absorbing curable composition contains a compound represented by formula (1) and a compound having a crosslinkable group. In formula (1), each of X1 and X2 independently represents O, S or a dicyanomethylene group; and each of A and B independently represents a group represented by formula (2). In formula (2), the wavy line represents a bonding position at which the group is bonded to formula (1); YS represents a group having an active hydrogen; A1 represents an aromatic hydrocarbon ring or an aromatic heterocyclic ring; RZ represents a substituent; m1 represents an integer of 0-mA; mA represents the maximum integer up to which RZ can be substituted by A1; YS may combine with A1 or RZ so as to form a ring; and RZ may combine with A1 so as to form a ring.
申请公布号 WO2017043175(A1) 申请公布日期 2017.03.16
申请号 WO2016JP70635 申请日期 2016.07.13
申请人 FUJIFILM CORPORATION 发明人 HIRAI Yuki;SASAKI Daisuke;JIMBO Yoshihiro
分类号 G02B5/22;C07C225/22;C07C233/43;C07C311/09;C07D209/04;C07D277/42;C07D519/00;C08F2/44;C08J3/24;C09K3/00 主分类号 G02B5/22
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