发明名称 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
摘要 A laminate 20 is formed by laminating resin films 10 comprising the same resin material. After a plurality of resin films 10 are integrated by heating and pressurizing the laminate 20, pressure applied to the laminate 20 is released and the laminate 20 is cooled. In a predetermined region R3 that becomes a bend of the laminate 20, one or more resin films 10 are disposed on both one side and the other side in the lamination direction of the resin films 10 with respect to one conductor pattern 11, and the total thickness of the one or more resin films 10 disposed on one side is larger than the total thickness of the one or more resin films 10 disposed on the other side. As a result, the predetermined region R3 can be bent using a difference between contraction force generated in the one or more resin films 10 disposed on one side and contraction force generated in the one or more resin films 10 disposed on the other side during the cooling after the heating and pressurization.
申请公布号 WO2017043299(A1) 申请公布日期 2017.03.16
申请号 WO2016JP74415 申请日期 2016.08.22
申请人 DENSO CORPORATION 发明人 HARADA, Toshikazu
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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