发明名称 ENCAPSULATION FILM
摘要 Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. Particularly, the encapsulation film, which effectively blocks moisture or oxygen entering the organic electronic device from the outside, and has excellent mechanical properties such as handleability and processability, and the organic electronic device including the same are provided.
申请公布号 US2017077450(A1) 申请公布日期 2017.03.16
申请号 US201615309376 申请日期 2016.02.17
申请人 LG CHEM, LTD. 发明人 Kim Hyun Suk;YOO Hyun Jee;MOON Jung Ok;YANG Se Woo
分类号 H01L51/52;H01L51/56 主分类号 H01L51/52
代理机构 代理人
主权项 1. An encapsulation film for an organic electronic element, comprising: a protective layer comprising a magnetic particle; a metal layer formed on the protective layer; and an encapsulation layer formed on the metal layer.
地址 Seoul KR