| 发明名称 |
Debonding Schemes |
| 摘要 |
An apparatus includes a bottom stage configured to hold a bottom surface of a substrate stack including at least two substrates, a top stage configured to hold a top surface of the substrate stack, and at least one blade configured to be inserted between two adjacent substrates of the substrate stack, wherein the at least one blade has a pointed tip in plan view and has a channel configured to inject air or fluid. |
| 申请公布号 |
US2017077062(A1) |
申请公布日期 |
2017.03.16 |
| 申请号 |
US201615345596 |
申请日期 |
2016.11.08 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Huang Xin-Hua;Liu Ping-Yin;Lin Hung-Hua;Chao Lan-Lin;Tsai Chia-Shiung |
| 分类号 |
H01L23/00;H01L21/683 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus, comprising:
a bottom stage configured to hold a bottom surface of a substrate stack including at least two substrates; a top stage configured to hold a top surface of the substrate stack; and at least one blade configured to be inserted between two adjacent substrates of the substrate stack, wherein the at least one blade has a pointed tip in plan view and has a channel configured to inject air or fluid. |
| 地址 |
Hsin-Chu TW |
