ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

摘要

An electronic device package and manufacturing method are provided, including steps of: providing a carrier having at least an electronic element and at least a package block disposed thereon, wherein the package block has a plurality of conductive posts bonded to the carrier; forming an encapsulant on the carrier for encapsulating the electronic element and the package block; and removing the carrier so as to expose the electronic element and the conductive posts from a surface of the encapsulant. As such, the invention dispenses with formation of through holes in the encapsulant for forming the conductive posts as in the prior art, thereby saving the fabrication cost.

主权项

1. An electronic package, comprising:
an encapsulant having a first surface and a second surface opposite to the first surface; at least an electronic element embedded in the encapsulant and exposed from the first surface of the encapsulant; and at least a package block embedded in the encapsulant and having at least one conductive post exposed from the first surface of the encapsulant.