COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

This copper paste for joining includes metal particles and a dispersant. The metal particles include sub- copper microparticles having a volume average particle diameter of 0.12-0.8 μm inclusive and flake-shaped copper microparticles having a maximum diameter of 1-20 μm inclusive and an aspect ratio of 4 or higher. The amount of copper microparticles included in the metal particles and having a maximum diameter of 1-20 μm inclusive and an aspect ratio of less than 2 is 50% by mass or less expressed in terms of the total amount of the flake-shaped copper microparticles.