| 摘要 |
[Problem] In the case of fabricating a flexible wiring device, for example, when the final curing and bonding time during final curing and bonding of an electroconductive reinforcing board and a flexible wiring board is reduced, peeling and other adhesion-related problems in a layered body sometimes occur in a subsequent reflow soldering step. [Solution] In the present invention, by using NBR having a carboxyl group, an epoxy resin, a curing agent, and an electroconductive material as constituent elements, and configuring the NBR having a carboxyl group so as to have a weight-average molecular weight of 5,000-1,000,000 and setting the nitrile monomer unit content to 5-45% by mass, an electroconductive adhesive composition can be provided in which peeling and other problems do not occur in a layered body even when the curing and bonding time is reduced. |
