发明名称 |
LAMINATED MAGNETIC MATERIALS FOR ON-CHIP MAGNETIC INDUCTORS/TRANSFORMERS |
摘要 |
A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers. |
申请公布号 |
US2017076852(A1) |
申请公布日期 |
2017.03.16 |
申请号 |
US201514854523 |
申请日期 |
2015.09.15 |
申请人 |
International Business Machines Corporation |
发明人 |
Deligianni Hariklia;Gallagher William J.;Kitayaporn Sathana;O'Sullivan Eugene J.;Romankiw Lubomyr T.;Wang Naigang;Yoon Joonah |
分类号 |
H01F27/28;H01F41/04;H01F27/24 |
主分类号 |
H01F27/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Armonk NY US |