发明名称 Protective Cover for an Acoustic Wave Device and Fabrication Method Thereof
摘要 A protective cover for an acoustic wave device and a fabrication method thereof, for protecting an acoustic wave device having a resonant area during a packaging operation so as to avoid molding compound flowing onto the resonant area of the acoustic wave device. The fabrication method comprises: defining a sacrificial area on the acoustic wave device; forming a sacrificial layer on the sacrificial area; covering a metal covering layer on the sacrificial layer and connecting a bottom rim of the metal covering layer to the acoustic wave device and forming an opening between the bottom rim of the metal covering layer and the acoustic wave device; and removing the sacrificial layer to form a cavity between the metal covering layer and the resonant area by using a chemical solution, wherein the chemical solution enters from the opening between the metal covering layer and the acoustic wave device.
申请公布号 US2017077899(A1) 申请公布日期 2017.03.16
申请号 US201615070383 申请日期 2016.03.15
申请人 WIN Semiconductors Corp. 发明人 Lin Cheng-Kuo;Tsai Shu-Hsiao;Syu Rong-Hao;Liu Yi-Ling;Lin Re-Ching;Liao Pei-Chun
分类号 H03H9/10 主分类号 H03H9/10
代理机构 代理人
主权项 1. An acoustic wave device protection structure, for protecting an acoustic wave device having a resonant area during a packaging operation so as to avoid molding compound flowing onto the resonant area of the acoustic wave device, the acoustic wave device protection structure comprising: a metal covering layer, having a concave surface and a bottom rim, the bottom rim connected to the acoustic wave device and forming at least one opening between the bottom rim and the acoustic wave device, and the concave surface covering over the resonant area to form a cavity between the concave surface and the resonant area.
地址 Tao Yuan City TW