| 摘要 |
The invention relates to a system (1) for checking solder joints, comprising a device (5) for automatic solder joint inspection which determines at least one quality feature of a solder joint to be checked in a predetermined inspection region of the solder surface, wherein the device (5) for automatic solder joint inspection scores the solder joint to be checked according to the determined quality feature, as a good solder joint (ASJIRG) or as a bad solder joint (ASJIRB), and a method for solder joint inspection. According to the invention, a device (4) for automatic component checking determines at least one geometric parameter of a component to be soldered, wherein, depending on the determined at least one geometric parameter of the component to be soldered, an evaluation and control unit (10) determines position and/or dimensions of the at least one corresponding inspection region and specifies same to the device (5) for automatic solder joint inspection in order to check the corresponding solder joint. |
