THERMALLY CONDUCTIVE CAMERA ENCLOSURE

摘要

Embodiments of the invention include devices, systems and methods for using or manufacturing a camera enclosure or mobile device that includes a thermally conductive camera module, such as having a minimum thermal conductivity of 200 watts per meter Kelvin (W/mK), that enhances heat transfer between a stiffener and cap of the enclosure. This allows heat produced by the camera to be conducted forward, away from the bottom of the stiffener, through the stiffener, and to the top of can so that the bottom of the stiffener does not heat to a high temperature, components of the device or an outer surface of a cover of the device near the bottom of the stiffener. This substantially increases the time before or avoids having the temperature of outer surface reach a high temperature, such as one that will be uncomfortable to the user. Other embodiments are also described and claimed.

主权项

1. A camera module comprising:
a camera enclosure comprising a stiffener and a can; the stiffener having a rear surface and sides extending forward from the rear surface; the can having a front surface, an opening in the front surface, and sides extending rearward from the front surface, the sides of the can being coupled to the sides of the stiffener; a camera located within the camera enclosure, the camera having a front portion comprising a lens; and a rear portion comprising an image sensor; the camera rear portion being coupled to the rear surface of the stiffener; the lens in the camera front portion facing the opening in the front surface of the can; wherein the stiffener is formed of a first Copper alloy material having a yield strength, an elongation, and a minimum thermal conductivity of 200 watts per meter Kelvin (W/mK); and wherein the can is formed of a second Copper alloy material having a yield strength smaller than that of the stiffener, an elongation greater than that of the stiffener, and a minimum thermal conductivity of 200 W/mK.