| 发明名称 |
METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE PACKAGE |
| 摘要 |
The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional colour conversion frit heat-treatment process and cutting process after bonding between the colour conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package chatacterized in that the present invention comprises: a colour conversion frit formation step for forming a colour conversion frit in which phosphor is included on a substrate; a colour conversion frit transcription step for transcribing the colour conversion frit formed on the substrate from the substrate to a transcription film; and a colour conversion frit bonding step for bonding the colour conversion frit transcribed on the transcription film onto a light-emitting diode package. |
| 申请公布号 |
US2017077363(A1) |
申请公布日期 |
2017.03.16 |
| 申请号 |
US201515311324 |
申请日期 |
2015.03.25 |
| 申请人 |
Corning Precision Materials Co., Ltd. |
发明人 |
Oh Yoon Seuk;Lee Ki Yeon;Moon Hyung Soo;Kim Bo Mi;Kim Jhee Mann;Park Cheol Min;Yang Choon Bong |
| 分类号 |
H01L33/50;H01L33/62 |
主分类号 |
H01L33/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a light-emitting diode package comprising:
forming a color conversion frit containing a fluorescent material on a substrate; transferring the color conversion frit formed on the substrate to a transfer film; and bonding the color conversion frit on the transfer film to a light-emitting diode chip. |
| 地址 |
Chungcheongnam-do KR |
