发明名称 SUBSTRATE SURFACE METALLIZATION METHOD AND SUBSTRATE HAVING METALLIZED SURFACE MANUFACTURED BY THE SAME
摘要 A substrate having a metallized surface is provided. The substrate includes a substrate having a silanated surface, an adhesive layer disposed on the silanated surface, and a first metallic layer bonded to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, and the colloidal nanoparticle group may include metallic nanoparticles capped with polymer. The first metallic layer and the adhesive layer have chemical bonds formed there between. The substrate may further include a second metallic layer which is electro-plated onto the first metallic layer. A method for metallizing a surface of a substrate is also provided.
申请公布号 US2017077059(A1) 申请公布日期 2017.03.16
申请号 US201615343029 申请日期 2016.11.03
申请人 National Tsing Hua University 发明人 WEI TZU-CHIEN;CHEN CHIH-MING;PAN TSENG-CHIEH;LAI KUEI-CHANG;WU CHUNG-HAN;CHEN KUEI-PO;OU NAI-TIEN;HONG CHENG-YOU
分类号 H01L23/00;H01L21/02;H01L23/532;H01L21/288;H01L23/528;H01L21/48;H01L21/285 主分类号 H01L23/00
代理机构 代理人
主权项 1. A substrate having a metallized surface, comprising: a substrate having a silanated surface; an adhesive layer disposed on the silanated surface, wherein the adhesive layer is formed with a plurality of colloidal nanoparticle groups, the colloidal nanoparticle groups include metallic nanoparticles capped with a polymer; and an electroless metallic layer bonded to the silanated surface through the adhesive layer; wherein the electroless metallic layer and the adhesive layer have chemical bonds formed there between.
地址 Hsinchu City TW
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