MICROELECTROMECHANICAL SENSOR DEVICE WITH REDUCED STRESS-SENSITIVITY AND CORRESPONDING MANUFACTURING PROCESS

摘要

A MEMS device is provided with: a supporting base, having a bottom surface in contact with an external environment; a sensor die, which is of semiconductor material and integrates a micromechanical detection structure; a sensor frame, which is arranged around the sensor die and is mechanically coupled to a top surface of the supporting base; and a cap, which is arranged above the sensor die and is mechanically coupled to a top surface of the sensor frame, a top surface of the cap being in contact with an external environment. The sensor die is mechanically decoupled from the sensor frame.

主权项

1. A MEMS device, comprising:
a supporting base having an inner surface and an outer surface; a sensor die including semiconductor material and integrating a micromechanical detection structure; a sensor frame arranged around the sensor die and coupled to the inner surface of the supporting base; a cap arranged above the sensor die and mechanically coupled to a surface of the sensor frame; and at least one conductive element electrically and mechanically coupling the sensor die to the sensor frame, the sensor frame supporting the sensor die only by the at least one conductive element.