发明名称 構造体および構造体の製造方法
摘要 PROBLEM TO BE SOLVED: To improve the degree of freedom in design of a conductive pattern when the conductive pattern is formed into a molding by light irradiation.SOLUTION: A structure 10 includes: a molding 2 having a through-hole 1; and a conductive pattern 3 which is provided on the molding 2 by light irradiation and passes through the through-hole 1. In a pattern formation region 4 on the inner wall in the through-hole 1 where the conductive pattern 3 is provided, a slope is provided, and the slope becomes sharp step by step or continuously toward an opening 6 from an opening 5.
申请公布号 JP6097026(B2) 申请公布日期 2017.03.15
申请号 JP20120153108 申请日期 2012.07.06
申请人 シャープ株式会社 发明人 片山 智文;武部 裕幸
分类号 H05K1/02;H05K1/11;H05K3/00 主分类号 H05K1/02
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