| 摘要 |
Electronic assemblies and their manufacture are described. One assembly includes a coreless substrate comprising a plurality of dielectric layers and electrically conductive pathways, the coreless substrate including a first side and a second side opposite the first side. The assembly includes a first die embedded in the coreless substrate, the first die comprising an RF die, the first die positioned in a dielectric layer that extends to the first side of the coreless substrate. The assembly includes a second die positioned on first side, the second die positioned on the first die. In another aspect, a molding material may be positioned on the die side, wherein the first die and the second die are covered by the molding material. In another aspect, an electrical shielding layer may be positioned over the first side. Other embodiments are described and claimed. |
