| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition capable of improving reliability of a semiconductor device, such as a power module having high adhesion between a metal frame and a sealing resin and used in a severe environment, and a power module using the same.SOLUTION: The semiconductor sealing epoxy resin composition containing an epoxy resin, a phenol resin based hardener, a curing accelerator and an inorganic filler as an essential component contains an aromatic polyvalent carboxylic acid having one nitro group in the molecule. |
