发明名称 レーザアニール装置及びレーザアニール方法
摘要 PROBLEM TO BE SOLVED: To provide a laser annealing device which enables suppression of roughing of a surface of a semiconductor substrate.SOLUTION: First and second laser devices respectively output first and second pulse laser beams. A propagation optical system makes the first and second pulse laser beams enter the same region on a surface of a work piece. On a path of the second pulse laser beam, a shutter is disposed. A control device starts opening operation of the shutter. Before a time point at which the shutter is entirely opened, outputting of the second pulse laser beam from the second laser device is started so that at least one laser pulse of the second pulse laser beam enters the work piece. After the shutter is entirely opened, the second pulse laser beam and the first pulse laser beam are outputted in synchronized manner.
申请公布号 JP6095515(B2) 申请公布日期 2017.03.15
申请号 JP20130155611 申请日期 2013.07.26
申请人 住友重機械工業株式会社 发明人 若林 直木
分类号 H01L21/265;H01L21/268 主分类号 H01L21/265
代理机构 代理人
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