发明名称 配線基板、発光装置及び配線基板の製造方法
摘要 There is provided a wiring substrate (1). The wiring substrate includes: a heat sink (10); an insulating layer (20) on the heat sink; first and second wiring patterns (30) on the insulating layer to be separated from each other at a certain interval; a first reflective layer (50) including a first opening (50X) on the insulating layer so as to cover the first and second wiring patterns, wherein a portion of the first and second wiring patterns is exposed from the first opening, and wherein the portion of the first and second wiring patterns is defined as a mounting region (CA) on which a light emitting element is to be mounted; and a second reflective layer (60) on the insulating layer, wherein the second reflective layer is interposed between the first and second wiring patterns. A thickness of the second reflective layer is smaller than that of the first reflective layer.
申请公布号 JP6096413(B2) 申请公布日期 2017.03.15
申请号 JP20120013243 申请日期 2012.01.25
申请人 新光電気工業株式会社 发明人 村松 茂次;清水 浩;堀川 泰愛
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
主权项
地址