| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition excellent in heat resistance, low water absorption, rigidity at high temperature, tensile physical properties, heat aging resistance and flowability, proceeding with crystallization efficiently when molded with a mold at 80°C, and having few contamination of the mold during manufacturing.SOLUTION: A polyamide resin composition contains (A) a polyamide resin containing a polyamide having a number average molecule weight of 2000 or more (a-1) of 95 to 99.95 mass% and a polyamide oligomer having the number average molecule weight of 500 or more and less than 2000 (a-2) in a range of 0.05 to 5 mass%, and in which 25 mol% or more of the total monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) is a constitutional unit derived from a specific alicyclic monomer and the percentage content of the trans isomer constitutional unit derived from the alicyclic monomer is 50 to 85 mol%, and (B) a nucleating agent. |
