| 摘要 |
PROBLEM TO BE SOLVED: To suppress, in a conductive laminate having a metal layer formed on a transparent conductive layer, increase in resistance of the transparent conductive layer when the metal layer is removed by etching.SOLUTION: The conductive laminate has, on at least one surface of a transparent substrate 1, a transparent conductive thin film laminate 2 comprising at least two layers of transparent conductive thin films, and a metal layer 3 laminated in this order. In the transparent conductive thin film laminate 2, a first transparent conductive thin film 21, which is the closest to the metal layer 3, is a metal oxide layer or a composite metal oxide layer comprising a main metal and one or more impurity metals. A transparent conductive thin film 22 other than the first transparent conductive thin film is a composite metal oxide layer comprising a main metal and one or more impurity metals. The problem to be solved is solved by that a content ratio of the impurity metals in the first conductive thin film 21 is not the largest of content ratios of the impurity metals in each transparent conductive thin film which constitutes the transparent conductive thin film laminate 2.SELECTED DRAWING: Figure 1 |
