| 摘要 |
Power and ground connections are provided using or more conductive layers provided in an integrated-circuit package design. A leadframe has either a tape assembly or a heat-conducting dielectric ceramic substrate attached to the die-attach paddle of the leadframe and one or more conductive planes are formed on the top surface of the tape assembly or the ceramic substrate. The tape assembly includes a conductive metal layer, a polyimide layer, and an adhesive layer. The metal layer on the tape or ceramic substrate and the metal die-attach pad of the leadframe are used as low inductance power planes providing connections to the integrated-circuit. No vias are used. Use of a metal die-attach paddle for the leadframe is optional when a ceramic substrate is used. |
