发明名称 部品供給装置
摘要 PROBLEM TO BE SOLVED: To suppress collision between a cutting edge exfoliating a top tape that covers a component housing part and components in the component housing part.SOLUTION: A component supply device 10 comprises: a tape feeding mechanism 14-18 which transfers a carrier tape 200 in a tape feed direction A toward a component supply position Q1; and a top tape exfoliation part 20 which partially exfoliates a top tape 206 from a base tape 204 to expose a component housing part 202. The top tape exfoliation part 20 comprises: a cutting edge 20a which partially exfoliates the top tape 206 from the base tape 204; a base tape cover surface 20e which is formed at a downstream side of the cutting edge 20a in the tape feed direction A, and covers the exposed component housing part 202; and an inclined surface 20j extended downward from the cutting edge 20a to the base tape cover surface 20e, and relatively alienates the base tape 204 from which the top tape 206 is exfoliated therefrom in the tape thickness direction with respect to the cutting edge 20a.
申请公布号 JP6094927(B2) 申请公布日期 2017.03.15
申请号 JP20130243164 申请日期 2013.11.25
申请人 パナソニックIPマネジメント株式会社 发明人 木谷 実;樋口 元寛;松川 茂
分类号 H05K13/02 主分类号 H05K13/02
代理机构 代理人
主权项
地址