| 摘要 |
A wiring board includes an insulating layer having a lower layer conductor on a lower surface thereof, a plurality of semiconductor element connection pads arranged in a lattice pattern in a semiconductor element mounting portion 1a having a quadrangular shape on the insulating layer, a via hole formed in the insulating layer below each of the semiconductor element connection pads, and a via conductor filled in the via hole and formed integrally with each of the semiconductor element connection pads. The wiring board includes a reinforcing via hole formed in the insulating layer in an outer region outside an arrangement region of the semiconductor element connection pads in corner portions of the semiconductor element mounting portion, and a reinforcing via conductor formed in the reinforcing via hole. |
