| 摘要 |
PROBLEM TO BE SOLVED: To optimize a bonding process.SOLUTION: A bonding device according to an embodiment comprises a chamber, a first holding part, a second holding part, a depressurization part, a pressurization mechanism and a control part. The first holding part is arranged in the chamber, for holding a first substrate by electrostatic adsorption. The second holding part is arranged in the chamber, for holding a second substrate. The depressurization part depressurizes the chamber. The pressurization mechanism contacts the first substrate with the second substrate by relatively moving the first holding part and the second holding part and applies pressure after the chamber is depressurized by the depressurization part. The control part stops application of voltage to the first holding part within a period from contact of the first substrate with the second substrate until a pressure application process is terminated. |
