| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of improving production efficiency by mounting and encapsulating in a very short time in a flip-chip packaging that electrical connection and curing of an encapsulation resin are performed simultaneously in a thermal compression bonding by a method of supplying the encapsulation resin to a circuit board in advance, and of suppressing generation of a void from the circuit board, of securing wettability of solder, and of suppressing peel-off between a semiconductor chip and the encapsulation resin, and to provide an acrylic resin composition for semiconductor encapsulation used for the same.SOLUTION: Provided is an acrylic resin composition for semiconductor encapsulation containing: a thermosetting acrylic resin that is liquid at room temperature; an organic peroxide having one-minute half-life temperature of 150-180°C that is a first radical starter for the thermosetting acrylic resin; an organic peroxide having one-minute half-life temperature of 200-220°C that is a second radical starter for the thermosetting acrylic resin; an activator; and an inorganic filler. |
