发明名称 センサーモジュールおよび電子機器
摘要 PROBLEM TO BE SOLVED: To provide a sensor module in which Q values of natural vibrations of substrates of a structure are reduced and occurrence of variations in sensor outputs due to vibration from an outside of the structure is reduced.SOLUTION: A structure 18 comprises: first substrates 25 and 27; and a second substrate 26. The first substrates 25 and 27 and the second substrate 26 are coupled to one another by crossing plate surfaces one another. The first substrates 25 and 27 and the second substrate 26 constitute side walls of an accommodation space. First sensors 53 and 57 are supported by the plate surfaces of accommodation space sides of the first substrates 25 and 27. A second sensor 54 is supported by the plate surface of an accommodation space side of the second substrate 26. Areas of the plate surfaces of the first substrates 25 and 27 and an area of the plate surface of the second substrate 26 in the accommodation space are different from one another.
申请公布号 JP6094034(B2) 申请公布日期 2017.03.15
申请号 JP20120028664 申请日期 2012.02.13
申请人 セイコーエプソン株式会社 发明人 木下 裕介
分类号 G01C19/5783;H05K1/14 主分类号 G01C19/5783
代理机构 代理人
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