| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in solvent resistance.SOLUTION: The photosensitive resin composition comprises a polymer, a crosslinking agent and a photosensitive material. A film is formed from the photosensitive resin composition by a spin coating process and then baked on a hot plate at 100°C for 120 seconds; and the obtained layer is exposed to UV rays with energy of 300 mJ/cmand then baked in an oven at 230°C for 60 minutes to obtain a first film. The film thickness of the first film is denoted by a first film thickness. The first film is immersed in N-methylpyrrolidone at 23°C for 10 minutes. The film thickness of thus treated film is denoted by a second film thickness. The film thicknesses satisfies [{(second film thickness)-(first film thickness)}/(first film thickness)]×100≤5. |
