发明名称 配線基板および基板モジュール
摘要 A wiring substrate includes a wiring pattern that is formed on a surface of a conductive board via an insulation layer and an extension part that is extended from the wiring pattern. The extension part is disposed in a portion located immediately below a detachable connector. The detachable connector is connected to a fixed connector mounted on the wiring substrate and connected and fixed to the wiring pattern.
申请公布号 JP6094415(B2) 申请公布日期 2017.03.15
申请号 JP20130153235 申请日期 2013.07.24
申请人 豊田合成株式会社 发明人 政次 美徳;加藤 英昭;三輪 朋弘
分类号 H05K3/34;H05K1/18 主分类号 H05K3/34
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