| 摘要 |
A substrate treatment method for removing a resist from a front surface of a substrate is provided. The method includes: a liquid mixture film forming step of forming a liquid film of a liquid mixture of a sulfuric acid-containing liquid and an organic solvent on a front surface of a substrate held by a substrate holding unit; and an infrared radiation applying step of providing a heater in opposed relation to the front surface of the substrate and applying infrared radiation emitted from the heater to the front surface of the substrate on which the liquid film of the liquid mixture is retained. |
