| 摘要 |
PROBLEM TO BE SOLVED: To enhance junction property between a cylindrical substrate and a cylindrical sputtering target material.SOLUTION: A cylindrical sputtering target is a combined body of a cylindrical substrate and a cylindrical sputtering target material. In the cylindrical sputtering target, a ten-point average roughness (Rz) of the cylindrical sputtering target material at a side of a junction material to combine the cylindrical substrate and the cylindrical sputtering material satisfies the following expression: d(μm)×α(μm/μmK)×ΔT(K)≤Rz(μm), where dμm is a thickness of the junction material, α(μm/μmK) is a linear coefficient of expansion of an adhesive agent and ΔT(K) is a difference between a melting point of the adhesive agent and a room temperature.SELECTED DRAWING: Figure 2 |
