| 摘要 |
A system includes a plurality of host processors and a plurality of HMC devices configured as a distributed shared memory for the host processors. An HMC device includes a plurality of integrated circuit memory die including at least a first memory die arranged on top of a second memory die and at least a portion of the memory of the memory die is mapped to include at least a portion of a memory coherence directory; and a logic base die including at least one memory controller configured to manage three-dimensional (3D) access to memory of the plurality of memory die by at least one second device, and logic circuitry configured to determine memory coherence state information for data stored in the memory of the plurality of memory die, communicate information regarding the access to memory, and include the memory coherence information in the communicated information. |
