| 摘要 |
PROBLEM TO BE SOLVED: To prevent an adverse effect caused by scattering of a solder.SOLUTION: A semiconductor module comprises: a base plate 1 with a principal surface including solder joint parts 2a, 2b and a case bonded part 3 which surrounds the solder joint parts 2a, 2b; solder resists 4a, 4b, 5 provided on the principal surface of the base plate 1 and between the solder joint parts 2a, 2b and the case bonded part 3; semiconductor devices 7a, 7b joined to the solder joint parts 2a, 2b, respectively, by solders 8a, 8b; and a case 12 which covers the semiconductor devices 7a, 7b and is bonded to the case bonded part 3. The solder resists 4a, 4b are provided along outer peripheries of the solder joint parts 2a, 2b, respectively. The solder resist 5 is provided along an inner periphery of the case bonded part 3 and arranged outside the solder resists 4a, 4b. The semiconductor module further comprises slits 6 which are provided among the solder resists 4a, 4b and the solder resists 5, for exposing the principal surface of the base plate 1 from the solder resists 4a, 4b, 5. |
