发明名称 銀粉及びその製造方法、並びに親水性導電ペースト
摘要 PROBLEM TO BE SOLVED: To provide a silver powder suitable for a conductive paste having excellent hydrophilicity and using a solvent with high water solubility or water, a manufacturing method therefor and a hydrophilic conductive paste.SOLUTION: There is provided a silver powder satisfying D-IPA>D-W, where cumulative 50% particle diameter when using isopropyl alcohol (IPA) as a measuring solvent for dispersing the silver powder is D-IPA (μm) and cumulative 50% particle diameter when using water as the measuring solvent for dispersing the silver powder is D-W (μm) and having phosphorus content in the silver powder of 0.01 mass% or more and 0.3 mass% or less in measurement of volume-based particle size distribution by a laser diffraction type particle size distribution measurement method.SELECTED DRAWING: None
申请公布号 JP6096261(B2) 申请公布日期 2017.03.15
申请号 JP20150188835 申请日期 2015.09.25
申请人 DOWAエレクトロニクス株式会社 发明人 田原 直樹;野上 徳昭;神賀 洋
分类号 B22F1/00;B22F9/24;H01B1/00;H01B1/22;H01B5/00 主分类号 B22F1/00
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