发明名称 |
ANISOTROPIC CONDUCTIVE MATERIAL, ELECTRONIC DEVICE INCLUDING ANISOTROPIC CONDUCTIVE MATERIAL, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE |
摘要 |
Provided are anisotropic conductive materials, electronic devices including anisotropic conductive materials, and/or methods of manufacturing the electronic devices. An anisotropic conductive material may include a plurality of particles in a matrix material layer. At least some of the particles may include a core portion and a shell portion covering the core portion. The core portion may include a conductive material that is in a liquid state at a temperature greater than 15 °C and less than or equal to about 110°C or less. For example, the core portion may include at least one of a liquid metal, a low melting point solder, and a nanofiller. The shell portion may include an insulating material. A bonding portion formed by using the anisotropic conductive material may include the core portion outflowed from the particle and may further include an intermetallic compound. |
申请公布号 |
EP3142124(A1) |
申请公布日期 |
2017.03.15 |
申请号 |
EP20160167463 |
申请日期 |
2016.04.28 |
申请人 |
Samsung Electronics Co., Ltd;Industry-Academic Cooperation Foundation, Yonsei University |
发明人 |
CHU, Kunmo;CHANG, Wonsuk;CHUNG, Chanmoon |
分类号 |
H01B1/22;H01L23/00;H01R4/04 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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