| 发明名称 |
EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING INSULATING LAYER USING SAME |
| 摘要 |
An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed. |
| 申请公布号 |
EP3138873(A1) |
申请公布日期 |
2017.03.08 |
| 申请号 |
EP20150785251 |
申请日期 |
2015.04.16 |
| 申请人 |
LG Innotek Co., Ltd. |
发明人 |
GU, Jina;GIL, Gun Young;PARK, Jae Man;YUN, Sung Jin |
| 分类号 |
C08K3/38;C08K3/22;C08K9/02;C08L63/00 |
主分类号 |
C08K3/38 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
