| 摘要 |
A multilayer wiring base plate includes an insulating plate including a plurality of synthetic resin layers made of an insulating material, a wiring circuit provided in the insulating plate, a thin-film resistor formed along at least one of the synthetic resin layers to be buried in the synthetic resin layer and inserted in the wiring circuit, and a heat expansion and contraction restricting layer formed to be buried in the synthetic resin layer adjacent to the synthetic resin layer in which the thin-film resistor is formed to be buried, arranged along the thin-film resistor, and having a smaller linear expansion coefficient than a linear expansion coefficient of the adjacent synthetic resin layers. |
