| 摘要 |
A system and method for providing a position and orientation sensor package having a reduced size in at least one dimension is disclosed. The position and orientation sensor package includes a dielectric substrate and a first magneto-resistance sensor chip attached to the dielectric substrate, the first magneto-resistance sensor chip including at least one magneto-resistance sensor circuit. The position and orientation sensor package also includes a second magneto-resistance sensor chip attached to the dielectric substrate and positioned adjacent the first magneto-resistance sensor chip, the second magneto-resistance sensor chip including at least one magneto-resistance sensor circuit. The position and orientation sensor package is constructed such that the at least one magneto-resistance sensor circuit of the first magneto-resistance sensor chip is oriented in a different direction than the at least one magneto-resistance sensor circuit of the second magneto-resistance sensor chip. |
