发明名称 発光モジュール
摘要 A light emitting module (1) includes: a first substrate (10) including a resin having insulation properties, and a copper component embedded in the resin; a second substrate (20) placed above the copper component of the first substrate (10), and soldered to the copper component; a mounting electrode (40) formed above the second substrate (20); and an LED (30) placed above the second substrate (20), and gold-tin soldered to the mounting electrode (40).
申请公布号 JP6090680(B2) 申请公布日期 2017.03.08
申请号 JP20150505291 申请日期 2014.03.11
申请人 パナソニックIPマネジメント株式会社 发明人 明田 孝典;佐名川 佳治;植田 充彦;吉原 孝明;林 真太郎;佐藤 利彦
分类号 H01L33/62;H01L23/36;H01L33/64;H01L51/50;H05B33/02;H05B33/14;H05B33/22;H05B33/24;H05B33/26;H05K1/14;H05K3/00 主分类号 H01L33/62
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