超高速レーザーパルスのバーストを使用して脆弱な材料基板から閉形状を取り除く方法

摘要

A method ofmachining and releasing closed forms (2) from a transparent, brittle substrate (1) includes using a burst of ultrafast laser pulses to drill patterns of orifices in the substrate (1). Orifices are formed by photoacoustic compression and they extend completely or partially in the transparent substrate (1). A scribed line of spaced apart orifices in the transparent substrate (1) comprise a closed form pattern (21s) in the substrate (1). A heat source forming a heating spot (21) is applied in a region about said scribed line (21s) of spaced apart orifices until the closed form pattern releases from the transparent substrate (1).