| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition or the like, capable of acquiring sufficient insulation reliability in a high-temperature humified atmosphere even when a wiring interval is small.SOLUTION: A resin composition contains a resin and an inorganic particle having a polar functional group measured by infrared spectroscopic analysis. A wiring structure contains a plurality of wirings and an insulation structure disposed around the wirings and formed of the resin composition. A multilayer circuit board includes a base material and a laminate comprising a plurality of wiring structures laminated on the base material. |
