| 摘要 |
A method, an arrangement and computer program product for manufacturing micro-optic surface design with complex, variable three-dimensional forms. A step embossing, step imprinting, a chip bonding or a corresponding device capable of patterning the surface of a target substrate is obtained. The target substrate whereto the micro-optic structures shall be patterned is obtained. A plurality of different stamping tools operable with the device is obtained. Each stamping tool includes one or more surface relief forms defining one or more micro-optic structures. A stamping tool is selected from the plurality of stamping tools by the device. The target substrate is embossed with the selected stamping tool as controlled by the device. The selected stamping tool is optionally heated or assisted by at least one ultraviolet light so as to cure the target substrate during or after the embossing. The selecting and embossing steps are repeated until the micro-optic surface design has been completed on the substrate. |
