发明名称 Solder joint
摘要 The joint has a truncated cone or truncated pyramid recess (4) i.e. tapped blind hole, arranged in an upper surface (3) of an electrically conductive body (1). An electrically conductive pin (2) is partially arranged in the recess, and a solder material (7) is arranged in an intermediate space (5) between a lateral surface (6) of the recess and pin and partially arranged on the pin and lateral surface of the recess. A rounded or pointed end of the pin is arranged in the recess. A receiving opening i.e. through hole, is arranged adjacent to a bottom portion (8) of the recess. An independent claim is also included for a fuse base comprising contact pins.
申请公布号 EP2437352(B1) 申请公布日期 2017.03.08
申请号 EP20110450127 申请日期 2011.09.29
申请人 Electrovac Metall-Glaseinschmelzungs GmbH 发明人 Bauer, Christian
分类号 H01R4/02;F42B3/103;H01R33/06 主分类号 H01R4/02
代理机构 代理人
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