发明名称 エポキシ樹脂ワニス、エポキシ樹脂組成物、硬化性シート、プリプレグ、積層板、プリント配線板および半導体装置
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin mixture and an epoxy resin composition having excellent heat conducting characteristics and also having excellent heat resistance and solvent solubility, and a cured product thereof.SOLUTION: An epoxy resin varnish comprises an epoxy resin represented by a general formula (1) and a solvent. In the formula, a plurality of Rs and Rs may be the same or different; Rs each independently represent a hydrogen atom, a hydroxyl group, a 1-10C alkyl group, an alkoxy group, a carboxyl group or a metal salt thereof, an alkoxycarbonyl group, an alkyl carbonylamino group, an alkyl carbonyl group, a halogen atom, a nitro group, a cyano group, or a phenyl group which may have a substituent; and m and n represent a positive number of 1-5.
申请公布号 JP6090784(B2) 申请公布日期 2017.03.08
申请号 JP20130087966 申请日期 2013.04.19
申请人 日本化薬株式会社 发明人 長谷川 篤彦;江原 清二;井上 一真;小淵 香津美
分类号 C08G59/08;B32B15/08;B32B15/092;C08J5/24;C08L63/00;H05K1/03 主分类号 C08G59/08
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