| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus capable of precisely depositing a uniform film on a film deposition object.SOLUTION: There is provided a film deposition device comprising: a film deposition source for heating a film deposition material to emit vapor of the film deposition material; moving means of moving the film deposition source between a predetermined film deposition standby position and a film deposition position relatively to the film deposition object; a crystal oscillator for measurement for measuring the emission amount of the film deposition material emitted from the vapor deposition source; and a crystal oscillator for calibration for calibrating the crystal oscillator for measurement. The film deposition apparatus further comprises a shutter provided nearby the crystal oscillator for calibration and temperature control means for controlling temperatures of the crystal oscillator for measurement and the crystal oscillator for calibration to substantially the same temperature.SELECTED DRAWING: Figure 1 |
