发明名称 フェノール樹脂、エポキシ樹脂、および硬化性樹脂組成物
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin and a curable resin composition, providing a cured product high in heat resistance and excellent in a water absorption rate and electric characteristics, regarding an epoxy resin, and a curable resin composition and its cured product, suitable for electric and electronic materials requiring heat resistance and flame retardancy.SOLUTION: (1) A phenol resin is obtained by a reaction between a binol and a xylylene compound, and an epoxy resin is obtained by using the phenol resin. (2) A curable resin composition contains at least one kind of the resins described in (1). (4) The cured product is obtained by curing the curable resin composition described in (2).
申请公布号 JP6090765(B2) 申请公布日期 2017.03.08
申请号 JP20120148665 申请日期 2012.07.02
申请人 日本化薬株式会社 发明人 中西 政隆;長谷川 篤彦
分类号 C08G61/02;C08G59/06;C08G59/20;C08G59/62 主分类号 C08G61/02
代理机构 代理人
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